China's thin grinding wheel supply capacity to improve, the pace of domestic substitution will accelerate.

Release time:

2024-10-28

The thinning grinding wheel is mainly used in the thinning and finishing processing of semiconductor wafers, and is one of the important tools for wafer thinning.

As an important country in the production and consumption of semiconductor wafers in the world, China occupies a pivotal position in the semiconductor industry chain.

At present, the domestic thinning grinding wheel in the market accounted for relatively low, about 10%. This means that a large amount of market share is occupied by foreign brands. But it also provides us with a huge alternative space and potential market opportunities. With the increasing attention and support of the country to the semiconductor industry, as well as the continuous progress of domestic enterprises in technology research and development and production process, we have reason to believe that the market share of domestic thinning grinding wheels will be significantly improved.

As an important part of semiconductor cutting grinding tools, the thinning grinding wheel has a wide variety of characteristics. According to the different materials added, we can subdivide the thinning grinding wheel into various types such as silicon carbide grinding wheel, diamond grinding wheel, alumina grinding wheel, gallium arsenide grinding wheel, ceramic grinding wheel and resin grinding wheel. These different types of thinning grinding wheels have their own advantages in terms of hardness, wear resistance, cutting efficiency, etc., and are suitable for semiconductor cutting and grinding needs of different materials and processes. Therefore, while promoting the development of domestic thinning grinding wheels, we also need to pay attention to technological innovation and product research and development to meet the diversified needs of the market.

The thinning grinding wheel is mainly used in the thinning and finishing processing of semiconductor wafers, and is one of the important tools for wafer thinning. The thinning process is to grind and thin the material on the back of the chip to achieve the target thickness. The thinning process can not only reduce the package volume and improve the circuit performance, but also help the chip to dissipate heat and improve the service life. In recent years, with the development of chip miniaturization and the upgrading of heat dissipation requirements, the demand for thinning grinding wheel applications has been continuously released.

Key words:

Sharp blade

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Zhengzhou Borui Abrasives Co., Ltd. welcomes you!

Since its establishment in 2016, Zhengzhou Borui Abrasives Co., Ltd. has been deeply engaged in the field of grinding tools for 8 years and has established a good reputation and brand image in the industry.